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Reballing BGA Leaded Solder Balls (250K balls 0.35mm)

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Reballing BGA Leaded Solder Balls (250K balls 0.35mm)
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14,80 €
China
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BrandPMTC
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Description

Tin balls for the rebole of processors, chipsets, etc.

  • Size: 0.35mm
  • Amount: 250 thousand
  • Leaded

 

CONTENT:
1 x tin balls with lead 0.35mm 250.000 pcs.

LEADED
Composition: 63Sn 37Pb
Manufactured: Profound Material Tecnology
(Taiwan)

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