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Reballing BGA Leaded Solder Balls (250K balls 0.30mm)

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Description

Tin balls for the output of processors, chipsets, etc.

  • Size: 0.30 mm
  • Amount: 250 thousand
  • Leaded

 

CONTENT:
1 x tin balls with lead 0.30 mm 250,000 pieces

LEADED
Composition: 63Sn 37Pb
Manufactured: Profound Material Tecnology
(Taiwan)

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