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Reballing BGA Leaded Solder Balls (250K balls 0.20mm)

Reballing BGA Leaded Solder Balls (250K balls 0.20mm)
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14,80 
Warehouse China
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Description

Tin balls for the rebole of processors, chipsets, etc.

  • Size: 0.20mm
  • Amount: 250 thousand
  • Leaded

 

CONTENT:
1 x tin balls with lead 0.20mm 250.000 pcs.

LEADED
Composition: 63Sn 37Pb
Manufactured: Deep Materials Technology
(Taiwan)

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