Reballing BGA Leaded Solder Balls (250K balls 0.20mm)
Description
Tin balls for the rebole of processors, chipsets, etc.
- Size: 0.20mm
- Amount: 250 thousand
- Leaded
CONTENT:
1 x tin balls with lead 0.20mm 250.000 pcs.
LEADED
Composition: 63Sn 37Pb
Manufactured: Deep Materials Technology
(Taiwan)
Opinions
No posts found